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High-Resolution Imaging with Microfocus Technology The X6800 delivers exceptional detail for inspecting small defects in dense SMT assemblies. Microfocus X-ray: 40–90kV with 5 µm focal spot High clarity: detects voids, microcracks, and trace breaks HD detector: sharp, high-contrast imaging Advanced Tilt and Viewing Flexibility Flexible viewing angles make it easier to inspect hidden defects. Up to 60° tilt: clear oblique-angle inspection Hidden defect detection: ideal for BGAs and QFNs Large work area: 530 × 530 mm, 10 kg capacity Smart Automation and Precision Analysis Advanced software and automation tools streamline inspection and improve consistency. Auto navigation: faster setup and positioning Advanced analysis: BGA voids, solder coverage, measurements Programmable workflows: repeatable, high-volume inspection 5-axis control: precise sample manipulation Built for reliability and ease of use, the X6800 supports efficient, high-precision inspection in demanding environments.
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🇺🇸 Ship from USA · On Agora since 2026
$89,995.00