TECBOND 268 Product Assembly Adhesive

TECBOND 268 is a high performance adhesive formulated for Polyolefin plastics such as polypropylene and polyethylene. This adhesive has a high heat resistance of 230ºF and good low temperature resistance of -22ºF To achieve a good bond on polypropylene it is important that the bond is made at the highest temperature possible ie > 392ºF. Good bonds can be achieved on polyethylene, polypropylene, polycarbonate, nylon, rigid PVC, light gauge metals and polystyrene. All bonds should be tested at least 24 hrs after assembly at both the high and low temperatures they will be expected to withstand in service. Industrial application: Packaging Chemistry: APAO Open time: Medium/Long Application Temperature: 195C-205C Color: Off white in 15mm (5/8")