Sn63/PB37 No Clean Solder Paste, Type 3, 10mL (35g) Syring with Dispensing Needle

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.) Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm. Features: Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Non-corrosive Non-conductive residue Halide-free Good wettability Type 3 (25-45 µm) Specifications: Type: Solder Paste Composition Sn63Pb37 (63/37) Melting Point: 361°F (183°C) Flux Type: No-Clean Mesh Type: 3 Process: Leaded Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C) Datasheet MSDS