Silicone Heat Transfer Compound, 60g Jar

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. High thermal conductivity High dielectric constant High dissipation factor Use with heat sinks or metal chassis Will not dry or harden Contains zincs oxides and polydimenthyl siloxane Meets MIL-DTL-47113D Specifications: Physical Properties: Test Method / Silicone 860 Appearance: Visual / White paste Consistency: ASTM D 217  Specific Gravity @ 25°C (77°F): 2.3 min Bleed % 24 hours @ 200°C: FTM-321 / 2.0% max Evaporation 24 hours @ 200°C: FTM-321 / 2.0% max Dropping Point: ASTM D-566 / > 500F (260°C) Max. operating temp.: 200°C (consistent) - 300°C intermittent Electrical Properties: Test Method / Silicone 860 Thermal Conductivity: Hot Wire Method Heat Flow #36 °C / 0.657 W/m•K Dielectric Strength (0.05l gap): ASTM D-149 / 400 V/MIL Dielectric Constant @ 1000 Hz: ASTM D-150 / 3.81 Dissipation Factor @ 1000 Hz: ASTM D-150 / 0.0032 Resistivity @ 21°C: ASTM D-150 / 1.5 x 1015 Ohm/cm Datasheet MSDS