OEM-NIG-TF no-clean rosin-based lead-free tacky paste flux (ROL0)

NIG-TF is a no-clean rosin-based tacky paste flux best suitable for soldering lead-free alloys Sn96.5Ag3.0Cu0.5, Sn96.5Ag3.5, Sn99.3Cu0.7, Sn99Ag0.3Cu0.7 to ENIG PCBs and Ni/Au finishing. NIG-TF is a traceable version of OEM 56L-TF includes QC-Aid for immediate visual PCB cleaning certification in UV/Blacklight – ROL0 flux classification - no-clean – Fine-tuned for Lead-free applications – More activity for lead-free alloys – Excellent wetting compatibility on most board finishes – Clear residue; Doesn’t short components – Wide process window – continue where you left off at a later time, once heated the flux will flow again Product keynotes – Rosin-based, more activity no-clean tacky solder flux best when used for operations with lead-free alloys and high-pitch solder powder in Medical Electronics and LED/Solar Industries, SAC alloys. – Excellent tackiness – holds components in place, clear residue. – Low viscosity – 20-48 (Malcom @ 10 RPM/25°C (x103mPa/s)) - easily flows under IC chips. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). – ROL0 classification – non-corrosive, doesn’t short circuits, can be left on board for multiple SMT assemblies. Clear residue can be easily removed by hot air, foam swab and basic solvents like isopropanol (best practice is to clean all flux residues all the time to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion). – Industrial air-syringe intended for pneumatic dispensing machines – to manually control the flow use a dispensing kit (plunger and tip sold separately). Do not remove the piston/stopper! Do not discard the original nozzle cap, tighten the cap while not using the flux – flux may dry out upon extended contact with air. Keep at a room temperature – do not refrigerate. OEM materials sold white-labeled, meaning outer package is labeled while individual items inside the pack are unlabeled. Ready for OEM manufacturing or BYOL re-marketing (Bring Your Own Label).