Frostbite-TG - Non-silicone Thermal Compound

STIRRI®Frostbite-TG™ Non-silicone Thermal Compound Used for mounting heat-generating assemblies to chassis (e.g., heat sink attachment to GPU/CPU/TPU), attachment of semiconductors, diodes, power transistors, ballast and thermal joints Non-silicone - avoids common contamination and migration issues typical to silicone-based pastes and greases, great ROI Top-shelf performance - long-term thermal stability without bleeding, drying, hardening, or melting Aids in minimizing component stress on high altitudes. Suitable for demanding cooling applications in aerospace, defense, automotive, medical electronics systems. No-drip, soft composition providing for low thermal resistance - highly efficient heat transfer Easily spreads into a thin, homogenous film for high-speed OEM production without curing Low evaporation index suitable for electrical vehicles and high-performance computing - data-center, AI, cryptocurrency computers, custom overclocked systems Industrial wet-out performance