HPX1S Die Attach Machine

Highly Accurate and Stable With an XY repeatability of ± 1.5μm and an XY placement accuracy of ± 25μm, this is a highly precise die attach machine that can be trusted to help your company produce high-quality semiconductor chips. The 8" magnetic waffle frame allows the machine to pick die attach components from size 1.4 x 1.4 mm to 7 x 7 mm. Great for Low Volume, Prototype, and Custom Applications  The high level of accuracy performed by this die attach machine makes it a perfect solution for prototyping, lab settings, low-volume assembly, on-demand production, and custom applications. Easy Programming The software on this equipment is Windows 7, ensuring a short learning curve for operators. Different methods are available for programming, tailoring the machine to your needs with Teach-In and Matrix Data Input systems.