CHIPSEN BoT-nLE523D Bluetooth v5.3 BLE Class1.5 (+7dBm) DIP Slave Module w/ Chip Antenna

Please CONTACT US for OEM and Quantity Discounts. The CHIPSEN BoT-nLE523D module features a BoT-nLE523 SMD master/slave Bluetooth module mounted on a DIP carrier with 2.54mm headers pins. This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port.  The electrical and performance specifications for this module are the same as the BoT-nLE523. See the BoT-nLE523 OEM Bluetooth module product page for full specifications.    BoT-nLE523D Features Bluetooth Processor: BoT-nLE523 (Master or Slave Mode) BT Version: Bluetooth Low Energy (BLE) V5 .3 Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module ARM® Cortex® M4 32 bit processor with FPU, 64 MHz Memory: 512 kB Flash / 128 kB RAM RF Output Power: MAX + 7 dBm ( 20 ~ 7 dBm) RF Receive Sensitivity: -93.5 dBm w/ Dirty Tx enable, 1Mbps Bluetooth Low Energy mode Type 2 near field communication (NFC A) tag with wakeup on field and touch to pair capabilities On chip LDO and DC/DC converter system (Used LDO by Default) Temperature Sensor UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces 12 Bit 200 ksps ADC with 7 configurable channels with programmable gain Size: 15 mm x 8 mm x 1.8 mm Operating Voltage: 2 7 V to 3. 6V Operating Temperature: -40 to +85℃ RoHS compliant Certifications: SIG, KC (including wireless EMC), FCC, CE, TELEC BoT-nLE523D Header Pins and Pinout The BoT-nLE523D is supplied with unsoldered 2.54mm header pins. The board can be wired into the circuit through the connection pads, or the header pins can be soldered in to plug the board into another PCB, plugged into a BoT-USB-TB Test Board.  BoT-nLE523D Bluetooth DIP Module mounted on a BoT-USB-TB Test Board: Documentation and Downloads BoT-nLE523 Datasheet and Installation Documentation (PDF)