CHIPSEN BoT-nLE521MD Bluetooth v5.0 BLE Class2 (+4dBm) DIP Master Module w/ Chip Antenna & Pin Headers

Please CONTACT US for OEM and Quantity Discounts. The CHIPSEN BoT-nLE521MD module features a BoT-nLE521 SMD master-mode module mounted on a DIP carrier with 2.54mm headers pins. This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port.  The electrical and performance specifications for this module are the same as the BoT-nLE521M. See the BoT-nLE521M OEM module product page for full specifications.   BoT-nLE521MD Features Bluetooth Processor: BoT-nLE521 (Master Mode) BT Version: Bluetooth Low Energy (BLE) V5 Built in Chip Antenna ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz Memory: 192 kB Flash / 24 kB RAM RF Output Power: MAX +4 dBm (-20 ~ 4 dBm) RF Receive Sensitivity: -96 dBm Type 2 near field communication (NFC-A) tag with wakeup-on-field and touch to-pair capabilities Fully automatic LDO and DC/DC regulator system (Uses LDO by Default) Temperature Sensor UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces 12-Bit 200 ksps ADC with - 8 configurable channels with programmable gain Size: 18 mm x 19 mm x 11 mm (including the header pins) Operating Voltage: 1.7V to 3.6V Operating Temperature: -40 to +85℃ RoHS compliant 1.4 Certifications: SIG, KC (including wireless EMC), IC, FCC, CE, TELEC BoT-nLE521MD Header Pins and Pinout The BoT-nLE521MD is supplied with unsoldered 2.54mm header pins. The board can be wired into the circuit through the connection pads, or the header pins can be soldered in to plug the board into another PCB, plugged into a BoT-USB-TB Test Board.  BoT-nLE521MD Bluetooth DIP Master Module mounted on a BoT-USB-TB Test Board: Documentation and Downloads BoT-nLE521 Datasheet and Installation Documentation (PDF) BoT-nLE521 FCC Certification (PDF)