CHIPSEN BoT-cDA110DC Bluetooth v5.1 SPP Class2 (+4dBm) DIP + Chip Antenna

Please CONTACT US for OEM and Quantity Discounts. The CHIPSEN BoT-cDA110DC module features a BoT-cDA110SC SPP Bluetooth module mounted on a DIP carrier with 2.54mm headers pins and an internal chip antenna. This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port.  The BoT-cDA110DC Serial Port Profile (SPP) Bluetooth module is a cost-effective, true system-on-chip (SoC) for classic Bluetooth applications. It complies with Bluetooth specification version 5.1 and integrates the RF and Baseband controller in a small package. This Bluetooth module has deployed MCU with Bluetooth function included chipset. BoT-cDA110DC Features BT Version: Complies with Bluetooth Core Specification v5.1 Built in Chip Antenna Supports Basic Rate (BR), Enhanced Data Rate (EDR) 2&3 Mbps TX RF Power: 4dBm RX sensitivity: -91dBm(BR) 96-MHz Arm Cortex-M4 microcontroller unit MCU 1MB Flash, 512KB RAM 1x peripheral UART Hardware security engine 16 GPIOs Wide operating voltage range: 2.7V to 3.6V Operating temperature range (-30℃ ~ 85℃) Size: 24mm x 22mm x 2.4mm Certifications: SIG, KC (including wireless EMC), FCC, CE RED with ROHs, TELEC Applications Bluetooth data communication Laptop / Handheld Device Bluetooth access point Industrial automation Remote meter reading system POS / Mobile printer BoT-cDA110DC Bluetooth SPP DIP Module mounted on a BoT-USB-TC Test Board: Documentation and Downloads BoT-cDA110SC/SU Datasheet and Installation Documentation (PDF) BoT-cDA110DC/DU Dimensions and Mechanical Specifications (PDF) BoT-cDA110 FCC Certification (PDF) BoT-cDA110 CE RED Certification (PDF)