Bambu Lab PC

Important Update: Bambu Lab Products Due to high demand, Bambu Lab products may have slightly longer lead times. We are diligently working with the vendor to ensure timely delivery. For the latest information on current stock, please contact one of our STEM Experts at 800.985.7836. Bambu Lab PLA PC Additional Resources: Technical Datasheet, Material Safety Sheet, Filament RoHS Highlights: Main Features Exceptional Thermal Resistance Excellent Mechanical Properties High Impact Strength and Durability Suitable for Engineering Purpose Comes with High Temperature Reusable Spool Diameter: 1.75mm +/- 0.03mm Enclosure Printers Required   Printing Tips • Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC. • Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed.   RFID for Intelligent Printing All printing parameters are embedded in RFID, which can be read through Bambu Lab's AMS (Automatic Material System). Load and print! No more tedious setting steps.   Technical Specifications: Accessory Compatibility Recommended Not Recommended Build Plate Smooth PEI Plate, Textured PEI Plate Cool Plate SuperTack Hotend All Size / Material / Glue Glue Stick Bambu Liquid Glue   Tech Specs Recommended Printing Settings Drying Settings (Blast Drying Oven) 80 °C，8h Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant) Nozzle Temperature 260 - 280 °C Bed Temperature (with Glue) 90 - 110 °C Printing Speed < 300 mm/s Physical Properties Density 1.20 g/cm³ Vicat Softening Temperature 119 °C Heat Deflection Temperature 117 °C Melting Temperature 228 °C Melt Index 32.2 ± 2.9 g/10 min Mechanical Properties Tensile Strength 55 ± 4 MPa Breaking Elongation Rate 3.8 ± 0.3 % Bending Modulus 2310 ± 70 MPa Bending Strength 108 ± 4 MPa Impact Strength 34.8 ± 2.1 kJ/m²