ASM-063 T3-T6 - Sn63Pb37 no-clean mid-temp leaded eutectic solder paste (ROL0)

ASM-063 T3-T6 - Sn63Pb37 no-clean mid-temp leaded eutectic solder paste (ROL0) - Sn63Pb37 soldering paste for SMT assemblies conforming to space exploration and defense contractors specs. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183ºC. Powder composition: 63% Tin, 37% Lead. Made using STIRRI-ASM-TF no-clean soldering tacky paste flux. - High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a translucent body of rosin soldering tacky flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air - STIRRI-ASM solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a solder iron. Essential for leaded rework/repair, solar exploration, unmanned flying devices and Sn63Pb37 military tech - Clear residue is not corrosive can be left on PCB, removed with isopropanol, cleaned in ultrasonic or a vapor degreasers. Contains QC-Aid special optical tracer glowing in UV for immediate visual PCB contamination inspection - easy to detect using UV/blacklight light and easy to clean using Isopropanol or any industrial solvent cleaner - paste will glow in UV highlighting affected areas. QC-Aid - Everyone Can QC - Factory-made in the USA using certified conflict-free solder powder traced back to original alloy smelters.