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Isolated round pads around each hole (8015-1) Plated-thru holes 0.080" diameter, isolated solder pad around each hole, both sides Unrestricted component placement, extended area for high density applications Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 4.00" / .062" Height: 6.00" 16-Pin DIP Capacity: 72 Material: FR4 FOR USE WITH: Wire Wrap Terminals: T44, T46, T49, T68 Solder Terminals: T42-1, K24C Wire-Wrap Socket Pins: R32 Hole Diameter: .042"
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🇺🇸 Ship from USA · On Agora since 2026
$10.95