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Circuit pattern etched onto wiring side only Solder mount DIP sockets or IC devices with any lead spacing 3-hole solder pads (0.28" x 0.080") for interconnecting multiple component leads Circuit Pattern: 3-Hole Solder Pad Contacts: N/A Width/Thick: 6.5 Height: 4.50" 16-Pin DIP Capacity: 20 Material: CEM-1 FOR USE WITH: Wire-Wrap Terminals: T44, T46, T49, T68 Solder Terminals: T42-1, K24C, K31C Wire-Wrap Socket Pins: R32 Hole Diameter: 0.042"
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🇺🇸 Ship from USA · On Agora since 2026
$26.95